
CL-O004-GROSGM-A
THERMAL HEAT SINK PASTE FOR USE ON ELECTRONIC COMPONENTS; TUBE, SYRINGE OR BOTTLE PRESENTATION; TEMPERATURE RANGE -40 TO 200ºC OR WIDER; BASIC COMPONENT: HIGH MOLECULAR WEIGHT…
מוצגים 7 מתוך 7 מוצרים של JAES — Electronic Components

THERMAL HEAT SINK PASTE FOR USE ON ELECTRONIC COMPONENTS; TUBE, SYRINGE OR BOTTLE PRESENTATION; TEMPERATURE RANGE -40 TO 200ºC OR WIDER; BASIC COMPONENT: HIGH MOLECULAR WEIGHT…

Organic flux in syringe for desoldering surface-mounted electronic components. 10cc presentation.

THERMAL HEAT SINK PASTE FOR USE ON ELECTRONIC COMPONENTS; TUBE, SYRINGE OR BOTTLE PRESENTATION; TEMPERATURE RANGE -40 TO 200ºC OR WIDER; BASIC COMPONENT: HIGH MOLECULAR WEIGHT…

THERMAL HEAT SINK PASTE FOR USE ON ELECTRONIC COMPONENTS; TUBE, SYRINGE OR BOTTLE PRESENTATION; TEMPERATURE RANGE -40 TO 200ºC OR WIDER; BASIC COMPONENT: HIGH MOLECULAR WEIGHT…

THERMAL HEAT SINK PASTE FOR USE ON ELECTRONIC COMPONENTS; TUBE, SYRINGE OR BOTTLE PRESENTATION; TEMPERATURE RANGE -40 TO 200ºC OR WIDER; BASIC COMPONENT: HIGH MOLECULAR WEIGHT…

Oily silicone paste with metal oxide for thermal coupling of electrical and electronic components in 20 ml tube Density 0.0286 g / mm3

Organic flux in syringe for desoldering surface-mounted electronic components. 10cc presentation.
מידע על אספקה, זמני אספקה וחלקי חילוף מקוריים
כל מה שאתה צריך לדעת על רכישת מוצרי JAES דרך JAES.