
CL-O004-GROSGM-A
THERMAL HEAT SINK PASTE FOR USE ON ELECTRONIC COMPONENTS; TUBE, SYRINGE OR BOTTLE PRESENTATION; TEMPERATURE RANGE -40 TO 200ºC OR WIDER; BASIC COMPONENT: HIGH MOLECULAR WEIGHT…
JAES termékek: 7 megjelenítve, összesen 7 — Electronic Components

THERMAL HEAT SINK PASTE FOR USE ON ELECTRONIC COMPONENTS; TUBE, SYRINGE OR BOTTLE PRESENTATION; TEMPERATURE RANGE -40 TO 200ºC OR WIDER; BASIC COMPONENT: HIGH MOLECULAR WEIGHT…

Organic flux in syringe for desoldering surface-mounted electronic components. 10cc presentation.

THERMAL HEAT SINK PASTE FOR USE ON ELECTRONIC COMPONENTS; TUBE, SYRINGE OR BOTTLE PRESENTATION; TEMPERATURE RANGE -40 TO 200ºC OR WIDER; BASIC COMPONENT: HIGH MOLECULAR WEIGHT…

THERMAL HEAT SINK PASTE FOR USE ON ELECTRONIC COMPONENTS; TUBE, SYRINGE OR BOTTLE PRESENTATION; TEMPERATURE RANGE -40 TO 200ºC OR WIDER; BASIC COMPONENT: HIGH MOLECULAR WEIGHT…

THERMAL HEAT SINK PASTE FOR USE ON ELECTRONIC COMPONENTS; TUBE, SYRINGE OR BOTTLE PRESENTATION; TEMPERATURE RANGE -40 TO 200ºC OR WIDER; BASIC COMPONENT: HIGH MOLECULAR WEIGHT…

Oily silicone paste with metal oxide for thermal coupling of electrical and electronic components in 20 ml tube Density 0.0286 g / mm3

Organic flux in syringe for desoldering surface-mounted electronic components. 10cc presentation.
Információk a szállításról, a szállítási időkről és az eredeti cserealkatrészekről
Minden, amit tudnia kell a JAES termékek JAES-en keresztüli beszerzéséről.