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THERMAL HEAT SINK PASTE FOR USE ON ELECTRONIC COMPONENTS; TUBE, SYRINGE OR BOTTLE PRESENTATION; TEMPERATURE RANGE -40 TO 200ºC OR WIDER; BASIC COMPONENT: HIGH MOLECULAR WEIGHT SILICON
THERMALTAKE - CL-O004-GROSGM-A
THERMAL HEAT SINK PASTE FOR USE ON ELECTRONIC COMPONENTS; TUBE, SYRINGE OR BOTTLE PRESENTATION; TEMPERATURE RANGE -40 TO 200ºC OR WIDER; BASIC COMPONENT: HIGH MOLECULAR WEIGHT SILICON