THERMAL HEAT SINK PASTE FOR USE ON ELECTRONIC COMPONENTS; TUBE, SYRINGE OR BOTTLE PRESENTATION; TEMPERATURE RANGE -40 TO 200ºC OR WIDER; BASIC COMPONENT: HIGH MOLECULAR WEIGHT SILICON
												
																								
											
												THERMAL HEAT SINK PASTE FOR USE ON ELECTRONIC COMPONENTS; TUBE, SYRINGE OR BOTTLE PRESENTATION; TEMPERATURE RANGE -40 TO 200ºC OR WIDER; BASIC COMPONENT: HIGH MOLECULAR WEIGHT SILICON