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THERMAL HEAT SINK PASTE FOR USE ON ELECTRONIC COMPONENTS; TUBE, SYRINGE OR BOTTLE PRESENTATION; TEMPERATURE RANGE -40 TO 200ºC OR WIDER; BASIC COMPONENT: HIGH MOLECULAR WEIGHT SILICON
MPU-2FK
(Na stanie)
DRAWING BOARD; TYPE: BOARD; MODEL: MPU-2FK; FOR STRESS RELIEVE 1; MANUFACTURER 1: THERMAL; PART-NO 1: MPU-2FK