IT
USA
DE
FR
ES
PT
IT
EN
USA
DE
ZH
ES
FR
JP
RU
AR
KR
PL
RO
VN
HE
TR
CS
HR
DA
FI
UA
EL
NL
SR
SK
SV
HU
NO
HI
ID
FA
THERMAL HEAT SINK PASTE FOR USE ON ELECTRONIC COMPONENTS; TUBE, SYRINGE OR BOTTLE PRESENTATION; TEMPERATURE RANGE -40 TO 200ºC OR WIDER; BASIC COMPONENT: HIGH MOLECULAR WEIGHT SILICON
DRAWING BOARD; TYPE: BOARD; MODEL: MPU-2FK; FOR STRESS RELIEVE 1; MANUFACTURER 1: THERMAL; PART-NO 1: MPU-2FK